Micro-electromechanical (MEMS) technology
|
| 发布时间：2014.05.03 新闻来源：Zhejiang Huiyue Bearing technology Co., Ltd. 浏览次数： |
| |
Micro-electromechanical (MEMS) technology position in the increasingly important electronic products, whether in the automotive, medical or military need to use such sophisticated components in the information, communications and consumer electronics, such as the mass market, but also You can see the rapid growth of the MEMS applications.
Is a kind of the micro-mechanical components (such as sensors, actuators, etc.) integrated semiconductor technology on the same chip with electronic circuitry MEMS nature. Usually the electrical characteristics of the chip just use a silicon semiconductor, while the use of MEMS electrical and mechanical properties of the two chips.
Dimensional microelectromechanical system (3D-MEMS), silicon is processed into a three-dimensional structure, the package and the contact assembly is easy to install and use this technology to produce a sensor with excellent accuracy, small size and low power consumption. This sensor can be produced by only a small piece out of silicon, and can measure acceleration in three mutually perpendicular directions. For example, to withstand strong vibration acceleration sensors and high-resolution altimeter provide suitable mechanical damping. Such sensors power consumption is very low, which makes them incomparable superiority in battery-powered devices.
MEMS sensor chip in the motion axis (X, Y, Z) on or cause a small amount of displacement of the movable tilted silicon structure, causing the capacitance between the movable and fixed components changed. Interface chip in the same package to convert the change in capacitance with a slight movement of an analog voltage proportional to the calibration. Typically analog sampling in two ways: electrostatic capacitive and piezoelectric resistive. The former advantages in low power consumption, lower current consumption.
Integration of MEMS and CMOS process technology, has successfully driven component products shine in consumer electronics applications, including Intel, Samsung, TI, TSMC and other leading semiconductor manufacturers are optimistic about the development of CMOS MEMS, and have invested in research and development related technologies. The CMOS MEMS components could further reduce product development costs, 3D MEMS packaging technology plays a key role.
3D packaging technology development in addition to solve the technical bottleneck in heterogeneous integration features, further integration of the various components can be simulated RF, Digital Logic, Memory, Sensor, mixed-signal, MEMS, etc., and this integration will not only shorten the signal transmission component distance, reduce power consumption, but also significantly increases the speed of signal transmission. In addition, thanks to the way the 3D stack, so in Form Factor, too, can achieve the highest chip capacity at a fixed unit volume.
With MEMS technology in the rapid rise of consumer electronics applications, and semiconductor manufacturing close to the limit, through the integration of MEMS and TSV technology CMOS process, the formation of 3D IC technology is gradually attracting attention. Due to the integration of heterogeneous 3D MEMS implicit characteristics, with low cost, small size, versatile, high-performance multiple advantages, it is expected to set off another wave of technology revolution in the future, and to bring greater development of CMOS MEMS opportunities.
|
| |
|
